李广芳

个人信息Personal Information

副研究员   博士生导师   硕士生导师  

性别:女

在职信息:在职

所在单位:化学与化工学院

学历:研究生(博士)毕业

毕业院校:美国南卡罗莱纳大学

学科:物理化学
材料化学

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个人简介Personal Profile

李广芳,女,18luck新利电竞 ,化学与化工学院,副研究员。2018年5月博士毕业于美国南卡罗莱纳大学;2018年8月至2019年9月在美国路易斯安纳州立大学从事博士后研究工作;2019年10月入职18luck新利电竞 ,主要从事金属纳米结构的设计与调控及其在能源、环境、微生物检测等领域的应用工作。


代表性论文

(1) J. Sun, Z. Wang, Y. Xu, T. Zhang, D. Zhu, G. Li*, and H. Liu*, Cobalt Nanoparticles Anchored on N-Doped Porous Carbon Derived from Yeast for Enhanced Electrocatalytic Oxygen Reduction Reaction, ChemSusChem 2023, e202201964.

(2)  J. Zhu, J. Huang, J. Dai, L. Jiang, Y. Xu, R. Chen, L. Li, X. Fu, Z. Wang, H. Liu, and G. Li*, Synergistic Combination of Fermi Level Equilibrium and Plasmonic Effect for Formic Acid Dehydrogenation, ChemSusChem 2023, e202202069.

(3) J. Huang, J. Dai, J. Zhu, R. Chen, X. Fu, H. Liu, G. Li*,Bimetallic Au-Cu gradient alloy for electrochemical CO2 reduction into C2H4 at low overpotential, J. Cat. 2022, 415, 134. 

(4)  J. Zhu, J. Huang, J. Dai, R. Chen, X. Fu, Z. Wang, H. Liu, G. Li*, Size Effect on Formic Acid Dehydrogenation over Plasmonic Au@Pd Core−Satellite Nanostructures, ACS Appl. Energy Mater. 2022, 5, 10013. 

(5) G. Li, Z. Wang, D. A. Blom, and H. Wang*, Tweaking the Interplay among Galvanic Exchange, Oxidative Etching, and Seed-Mediated Deposition toward Architectural Control of Multimetallic Nanoelectrocatalysts, ACS Appl. Mater. Interfaces, 2019, 11, 26, 23482.

(6) G. LiM. Sun, E.Villarreal, S.Pandey, S. Phillpot and H. Wang*, Galvanic Replacement-Driven Transformations of Atomically Intermixed Bimetallic Nanocrystals: Effects of Compositional Stoichiometry and Structural Ordering, Langmuir 2018, 34, 4340.

(7) G. Li, Y. Lin, and H. Wang*, Residual Silver Remarkably Enhances Electrocatalytic Activity and Durability of Dealloyed Gold Nanosponge Particles, Nano Lett. 2016, 16, 7248. 

(8) G. Li, E.Villarreal, Q. Zhang, T. Zheng, J. Zhu, and H. Wang*, Controlled Dealloying of Alloy Nanoparticles toward Optimization of Electrocatalysis on Spongy Metallic Nanoframes, ACS Appl. Mater. Interfaces, 2016, 8, 23920. 




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